On February 25, Redmi held a press conference to announce the
new K40 series of mobile phones, laptops and TVs. Redmi's new wireless headset
Redmi Airdots 3 also made a surprise appearance.
Redmi Airdots 3 is equipped with a new generation of Qualcomm
QCC3040 Bluetooth audio SoC, which supports Bluetooth V5.2, built-in moving
coil + moving iron dual unit, which can be said to be the largest upgrade of
Redmi Airdots series of true wireless headphones.
Redmi
Airdots 3 continues the appearance of its predecessor. The earphones are
bean-in-ear and compact in size. A new round of polished arc is added to the
outer ring of the earphones to increase recognition.Charging
case for clamshell design, plastic body frosted feel.The
previous Redmi Airdots 2, Redmi Airdots S and the original Redmi Airdots were
all similar designs.
Although
the appearance is similar, the Redmi Airdots 3 has been greatly upgraded in
terms of internal structure and materials. First of all, the headset is
equipped with two high-resolution sound units of high-frequency moving iron and
low-frequency moving coil, which give full play to the respective advantages of
the two speaker units, with both bass sound field and high-pitch details.
Second,
Redmi Airdots 3 adopts Qualcomm's new generation of Bluetooth audio SoC
QCC3040, which supports Qualcomm's second generation APTX Adaptive codec. It
can automatically switch between APTX HD high sound quality (24bit/ 48kHz) and
APTX Low Latency (16bit/ 44.1kHz) according to the user's use of the headset,
taking into care of user experience and battery life.And
this chip has also passed the Bluetooth V5.2 certification, and with the
support of Bluetooth V5.2 carrying Qualcomm flagship chip mobile phone
connection, in connection stability and power consumption and other aspects
will have a better performance.
